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Global Mixed-mode Technology Inc.
G914X
300mA Low-Noise LDO Regulators
Features
Ultra Low Output Noise30V (rms) Ultra Low 55A No-Load Supply Current Ultra Low Dropout 70mV @ 50mA Load Guarantee 300mA Output Current Over-Temperature and Short-Circuit Protection Fixed: 2.70V (G914A), 2.80V (G914B) 3.00V (G914C), 3.30V (G914D) 2.50V (G914E), 2.85V (G914F) 1.50V(G914G), 1.80V(G914H) Max. Supply Current in Shutdown Mode < 1A Stable with low cost ceramic capacitors
General Description
The G914X is a low supply current, low dropout linear regulator that comes in a space saving SOT23-5 package. The supply current at no-load is 55A. In the shutdown mode, the maximum supply current is less than 1A. Operating voltage range of the G914X is from 2.5V to 5.5V. The over-current protection limit is set at 500mA typical and 400mA minimum. An over-temperature protection circuit is built-in in the G914X to prevent thermal overload. These power saving features make the G914X ideal for use in the battery-powered applications such as notebook computers, cellular phones, and PDA's.
Applications
Notebook Computers Cellular Phones PDA Hand-Held Devices Battery-Powered Application
Ordering Information
ORDER MARKING VOLTAGE NUMBER
G914A G914B G914C G914D G914E G914F G914G G914H 4Axx 4Bxx 4Cxx 4Dxx 4Exx 4Fxx 4Gxx 4Hxx 2.70V 2.80V 3.00V 3.30V 2.50V 2.85V 1.50V 1.80V
TEMP. RANGE
-40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C -40C~ +85C
PACKAGE
SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5 SOT 23-5
Pin Configuration
Typical Operating Circuit
IN
1
5
OUT
IN
OUT
OUTPUT VOLTAGE
GND
2
G914X
4 SOT23-5 BYP
C
BATTERY
G914X
SHDN BYP GND
_ 1F
IN
COUT 1F CBYP
10nF
SHDN
3
Fixed mode
Ver: 1.2 Jun 30, 2002
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
VIN to GND.............................................-0.3V to +7V Output Short-Circuit Duration.............................Infinite All Other Pins to GND....................-0.3V to (VIN + 0.3V) Continuous Power Dissipation (TA = +25C) SOT 23-5 ....................................................520 mW
Note (1): See Recommended Minimum Footprint (Figure 2)
G914X
Operating Temperature Range...........-40C to +85C Junction Temperature.................................+150C (1) JA ..................................................240C/Watt Storage Temperature Range............-65C to +160C Lead Temperature (soldering, 10sec).............+260C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
(VIN=VOUT(STD)+1V, V SHDN =VIN, TA=TJ =25C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS
Input Voltage (Note 2) Output Voltage Accuracy Maximum Output Current Current Limit (Note 3) Ground Pin Current VIN VOUT
MIN TYP MAX UNITS
5.5 V 2 % 3 4 300 mA 500 mA 55 120 A 145 265 2 70 230 250 380 mV 510 450 600 500 660 760 960 910 1220 0.1 0.28 %/V 0.35 % 2 57 dB 30 ppm/C 52 35 VRMS 30 26 V A C C
Note2 Variation from specified VOUT, IOUT=1mA,VOUT2.5V version -2 For G914H, IOUT=1mA -3 For G914G, IOUT=1mA -4
ILIM IQ VIN =3.6V ILOAD = 0mA ILOAD = 50mA ILOAD = 300mA
IOUT = 1mA IOUT = 50mA, VOUT 2.7V Version VO (NOM) 3.0V 2.5VVO (NOM) 2.85V IOUT = 150mA VO (NOM) = 1.8V Dropout Voltage (Note 4) VDROP VO (NOM) = 1.5V VO (NOM) 3.0V 2.5VVO (NOM) 2.85V IOUT =300mA VO (NOM) = 1.8V VO (NOM) = 1.5V Line Regulation VLNR VIN=VOUT+100mV to 5.5V, IOUT = 1mA IOUT = 1mA to 150mA Load Regulation (Note 5) VLDR IOUT = 1mA to 300mA Power Supply Rejection Ratio PSRR IOUT = 30mA CBYP = 10nF, f = 120HZ Output Voltage Temperature Coefficient VO/T IOUT = 50mA, TJ = 25C to 125C COUT = 1F, IOUT = 150mA, CBYP=1nF Output Voltage Noise COUT = 1F, IOUT = 150mA, CBYP=10nF (10Hz to 100kHz) en VIN=VOUT+1V COUT = 1F, IOUT = 150mA, CBYP = 100nF (G914H) COUT = 1F, IOUT = 1mA, CBYP = 10nF SHUTDOWN VIH Regulator enabled VIN- 0.7 SHDN Input Threshold Regulator shutdown VIL ISHDN V SHDN = VIN TA = +25C 0.003 SHDN Input Bias Current Shutdown Supply Current IQ SHDN VOUT = 0V TA = +25C THERMAL PROTECTION Thermal Shutdown Temperature TSHDN 150 Thermal Shutdown Hysteresis 15 TSHDN
0.4 0.1 1
Note 1: Limits is 100% production tested at T A = +25C. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note 2: VIN (min)=VOUT (STD)+VDROPOUT Note 3: Not tested. For design purposes, the current limit should be considered 400mA minimum to 600mA maximum. Note 4: The dropout voltage is defined as (VIN - VOUT) when VOUT is 100mV below the value of VOUT for VIN = VOUT +1V. The performance of every G914X version, see "Typical Performance Characteristics". Note 5: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 1mA to 300mA. Changes in output due to heating effects are covered by the thermal regulation specification. Ver: 1.2 Jun 30, 2002 TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
(VIN = V O+1V, CIN=1F, COUT=1F, V SHDN = VIN, G914D, TA =25C, unless otherwise noted.) Output Voltage vs. Load Current
3.340 3.330 3.320
G914X
Ground Current vs. Load Current
400 350
G914D
Ground Current (A)
Output Voltage (V)
3.310 3.300 3.290 3.280 3.270 3.260 3.250 3.240 0 50 100 150 200 250 300
300 250 200 150 100 50 0 0 50 100 150
VIN=3.6V No Load
200
250
300
Load Current (mA)
Load Current (mA)
Output Voltage vs. Input Voltage
3.5 3.0
Supply Current vs. Input Voltage
400 350
No Load
ILOAD=300mA
Output Voltage (V)
Supply Current (A)
2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 4 5 6
300 250 200 150 100 50 0 0 1 2
ILOAD=50mA
ILOAD=0mA
3 4 5 6
Input Voltage (V)
Input Voltage (V)
Dropout Voltage vs. Load Current
1000 900
Ouptut Noise 10HZ to 100KHZ
TA=25C
G914H G914E G914G
Top to down G914A G914B G914F G914C G914D 0 50 100 150 200 250 300
Dropout Voltage (mV)
800 700 600 500 400 300 200 100 0
Loading (mA)
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
G914X
Ground Current vs. Temperature
100
SHDN Input Bias Current vs. Temperature
0.20
Ground Current (A)
80
SHDN Input Bias Current (A)
G914D VIN = 4.3V IOUT =0A
0.10
G914D VIN=4.3V VSHDN=VIN
60
0.00
40
20
-0.10
0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0000
-0.20
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0000
Junction Temperature TJ (C)
Junction Temperature TJ (C)
Shutdown Supply Current vs. Temperature
1.00 3.36 G914D VIN = 4.3V 3.34
Output Voltage vs. Temperature
G914D ILOAD=1mA VIN=5.5V
Shutdown Supply Current(A)
0.60
Output Voltage (V)
3.32 3.30 VIN=4.3V 3.28 VIN=3.4V 3.26 3.24
0.20
-0.20
-0.60
-1.00
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0000
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0000
Junction Temperature TJ (C)
Junction Temperature TJ (C)
Dropout Voltage vs. Temperature
400 350 G914D
Dropout Voltage (mV)
300 250 200 150 100 50 ILOAD=0mA 0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 10 11 12 13 0000
ILOAD=150mA
ILOAD=50mA
Junction Temperature TJ (C)
Ver: 1.2 Jun 30, 2002
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Line Transient
G914X
Load Transient
Load Transient
Power Supply Rejection Ripple
80 70
Power Supply Rejection Ratio(db)
60 50 40 30 20 10 0 0.1 1
G914F VIN=5V +2V(p-p) RL=100 CBYP=10nF
10
100
Frequency(KHZ)
Output Noise vs. Bypass Capacitance
70 60 G914H VIN=2.8V TA=25C COUT=1F 70 60
Output Noise vs. Load Current
G914H VIN=2.8V TA=25C COUT=1F 40 30 20 10 0
Output Noise (Vrms)
Output Noise (Vrms)
0.1
50 40 30 20 10 0 0.001
50
0.01
1
10
100
1000
Bypass Capacitance (F)
Load Current (mA)
Ver: 1.2 Jun 30, 2002
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
Power On Response Waveform
G914X
Power Off Response Waveform
Shutdown Delay Waveform
Shutdown Delay Waveform
Turn-On Time vs. Bypass Capacitance
100000 Propagation Delay Time
Turn-Off Time vs. Bypass Capacitance
1000 Propagation Delay Time
10000
Time (s)
100
Time (s)
1000 G914D ILOAD =150mA CIN=COUT=1F VIN=4.3V power already VSHDN=0 to 4.3V
100
Fall Time 10
10 Rise Time 1 0.1 1
G914D ILOAD =150mA CIN=COUT=1F VIN=4.3V power already VSHDN=4.3V to 0V 10 100
1
Bypass Capactor (nF)
10
100
0.1
1
Bypass Capacitor (nF)
Ver: 1.2 Jun 30, 2002
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Global Mixed-mode Technology Inc.
Pin Description
PIN
1 2 3 4 5
G914X
NAME
IN GND
SHDN
FUNCTION
Regulator Input. Supply voltage can range from +2.5V to +5.5V. Bypass with 1F to GND. Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to maximize thermal dissipation. Active-High Enable Input. A logic low reduces the supply current to less than 1A. Connect to IN for normal operation. This is a reference bypass pin. It should connect external 10nF capacitor to GND to reduce output noise. Bypass capacitor must be no less than 1nF. (CBYP 1nF) Regulator Output. Sources up to 150mA. Bypass with a 1F, 0.2 typical ESR capacitor to GND.
BYP OUT
Detailed Description
The block diagram of the G914X is shown in Figure 1. It consists of an error amplifier, 1.25V bandgap reference, PMOS output transistor, internal feedback voltage divider, shutdown logic, over current protection circuit, and over temperature protection circuit. The internal feedback voltage divider's central tap is connected to the non-inverting input of the error amplifier. The error amplifier compares non-inverting input with the 1.25V bandgap reference. If the feedback voltage is higher than 1.25V, the error amplifier's output becomes higher so that the PMOS output transistor has a smaller gate-to-source voltage (VGS). This reduces the current carrying capability of the PMOS output transistor, as a result the output voltage decreases until the feedback voltage is equal to 1.25V.
Similarly, when the feedback voltage is less than 1.25V, the error amplifier causes the output PMOS to conduct more current to pull the feedback voltage up to 1.25V. Thus, through this feedback action, the error amplifier, output PMOS, and the voltage divider effectively form a unity-gain amplifier with the feedback voltage force to be the same as the 1.25V bandgap reference. The output voltage, VOUT, is then given by the following equation: VOUT = 1.25 (1 + R1/R2). (1) Alternatively, the relationship between R1 and R2 is given by: R1 = R2 (VOUT / 1.25 + 1). (2) For the output voltage versions of G914X, the output voltages are 2.7V for G914A, 2.8V for G914B, 3.0V for G914C, 3.3V for G914D, and 2.5V for G914E, 2.85V for G914F, 1.50V for G914G and 1.80V for G914H.
IN SHDN
SHUTDOWN LOGIC ERROR AMP OVER CURRENT PROTECT & DYNAMIC FEEDBACK
OUT BYP
R1
OVER TEMP. PROTECT 1.25V Vref
CBYP R2
GND
Figure 1. Functional Diagram
Ver: 1.2 Jun 30, 2002
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Global Mixed-mode Technology Inc.
Over Current Protection The G914X use a current mirror to monitor the output current. A small portion of the PMOS output transistor's current is mirrored onto a resistor such that the voltage across this resistor is proportional to the output current. This voltage is compared against the 1.25V reference. Once the output current exceeds the limit, the PMOS output transistor is turned off. Once the output transistor is turned off, the current monitoring voltage decreases to zero, and the output PMOS is turned on again. If the over current condition persist, the over current protection circuit will be triggered again. Thus, when the output is shorted to ground, the output current will be alternating between 0 and the over current limit. The typical over current limit of the G914X is set to 500mA. Note that the input bypass capacitor of 1F must be used in this case to filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board's routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating. Over Temperature Protection To prevent abnormal temperature from occurring, the G914X has a built-in temperature monitoring circuit. When it detects the temperature is above 150oC, the output transistor is turned off. When the IC is cooled down to below 135oC, the output is turned on again. In this way, the G914X will be protected against abnormal junction temperature during operation. Shutdown Mode When the SHDN pin is connected a logic low voltage, the G914X enters shutdown mode. All the analog circuits are turned off completely, which reduces the current consumption to only the leakage current. The output is disconnected from the input. When the output has no load at all, the output voltage will be discharged to ground through the internal resistor voltage divider. Operating Region and Power Dissipation Since the G914X is a linear regulator, its power dissipation is always given by P = IOUT (VIN - VOUT). The maximum power dissipation is given by: PDMAX = (TJ - TA)/JA = (150-25) / 240 = 520mW Where (TJ - TA) is the temperature difference the G914X die and the ambient air, JA, is the thermal resistance of the chosen package to the ambient air. For surface mount device, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. In the case of a SOT23-5 package, the thermal resistance is typically 240oC/Watt. (See Recommended Minimum Footprint) [Figure 2]. Refer to Figure 3 is the G914X valid operating region (Safe Operating Area) & refer to Figure 4 is maximum power dissipation of SOT 23-5.
G914X
The die attachment area of the G914X's lead frame is connected to pin 2, which is the GND pin. Therefore, the GND pin of G914X can carry away the heat of the G914X die very effectively. To improve the power dissipation, connect the GND pin to ground using a large ground plane near the GND pin.
Applications Information
Capacitor Selection and Regulator Stability Normally, use a 1F capacitor on the input and a 1F capacitor on the output of the G914X. Larger input capacitor values and lower ESR provide better supply-noise rejection and transient response. A highervalue input capacitor (10F) may be necessary if large, fast transients are anticipated and the device is located several inches from the power source. For stable operation over the full temperature range, with load currents up to 120mA, a minimum of 1F is recommended. Power-Supply Rejection and Operation from Sources Other than Batteries The G914X is designed to deliver low dropout voltages and low quiescent currents in battery powered systems. Power-supply rejection is 57dB at low frequencies as the frequency increases above 20kHz; the output capacitor is the major contributor to the rejection of power-supply noise. When operating from sources other than batteries, improve supply-noise rejection and transient response by increasing the values of the input and output capacitors, and using passive filtering techniques. Load Transient Considerations The G914X load-transient response graphs show two components of the output response: a DC shift of the output voltage due to the different load currents, and the transient response. Typical overshoot for step changes in the load current from 0mA to 100mA is 12mV. Increasing the output capacitor's value and decreasing its ESR attenuates transient spikes. Input-Output (Dropout) Voltage A regulator's minimum input-output voltage differential (or dropout voltage) determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful end-of-life battery voltage. Because the G914X use a P-channel MOSFET pass transistor, their dropout voltage is a function of RDS(ON) multiplied by the load current cause the G914X use a P-channel MOSFET pass transistor, their dropout voltage is a function of RDS(ON) multiplied by the load current.
Ver: 1.2 Jun 30, 2002
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Layout Guide An input capacitance of 1F is required between the G914X input pin and ground (the amount of the capacitance may be increased without limit), This capacitor must be located a distance of not more than 1cm from the input and return to a clean analog ground. Input capacitor can filter out the input voltage spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board's
G914X
routing wire. Otherwise, the actual voltage at the IN pin may exceed the absolute maximum rating. The output capacitor also must be located a distance of not more than 1cm from output to a clean analog ground. Because it can filter out the output spike caused by the surge current due to the inductive effect of the package pin and the printed circuit board's routing wire. Figure 5 is G914X PCB recommended layout.
Figure 2. Recommended Minimum Footprint
Safe Operating Area [Power Dissipation Limit]
400 350 300 Output Current (mA) 250 200 150 100 50 0
0.1 0.4 0.7 1.0 1.3 1.6 1.9 2.2 1oz Copper on SOT-23-5 Package Mounted on recommended mimimum footprint (RJA=240C/W)
Maximum Power Dissipation of SOT-23-5
0.7
Still Air 1oz Copper on SOT-23-5 Package Mounted on recommended mimimum footprint (RJA=240C/W)
Maximum Recommended Output Current
Still air 0.6 0.5 Power Dissipation (W) 0.4 0.3 0.2 0.1 0
25
TA=85C TA=55C TA=25C
35
45
55
65
75
85
95
105
115
125
Input-Output Voltage Differential VIN-VOUT (V)
Amibent Temperature TA (C)
Note: VIN(max) <= 5.5V
Figure 3. Safe Operating Area
Figure 4. Power Dissipation vs. Temperature
Figure 4 Safe Operating Area
Figure 5. Fixed Mode
*Distance between pin & capacitor must no more than 1cm
Ver: 1.2 Jun 30, 2002
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Package Information
D C L
G914X
E
H
e1 e
1
A A2 A1
b
Note: 1. Package body sizes exclude mold flash protrusions or gate burrs 2. Tolerance 0.1000 mm (4mil) unless otherwise specified 3. Coplanarity: 0.1000mm 4. Dimension L is measured in gage plane SYMBOLS
A A1 A2 b C D E e e1 H L 1
MIN
1.00 0.00 0.70 0.35 0.10 2.70 1.40 --------2.60 0.37 1
DIMENSIONS IN MILLIMETERS NOM
1.10 ----0.80 0.40 0.15 2.90 1.60 1.90(TYP) 0.95 2.80 -----5
MAX
1.30 0.10 0.90 0.50 0.25 3.10 1.80 --------3.00 ----9
Taping Specification
Feed Direction SOT23-5 Package Orientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Ver: 1.2 Jun 30, 2002
TEL: 886-3-5788833 http://www.gmt.com.tw
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